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1. R&D objectives|2. R&D overview | 3. R&D content |
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In order to provide effective and efficient maintenance and renewal in
accordance with the condition of existing road infrastructure, we will
develop technologies for a “ROAD Infrastructure Monitoring System (RIMS)”
capable of correctly ascertaining the condition of road infrastructure
with the objective of contributing to the resolution of economic problems
as well as human resources and technological shortages in the area of road
infrastructure maintenance and renewal.
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Of Japan’s social infrastructures, road infrastructure comprises 92.3%
of land freight transportation volume (265.5 billion ton-kilometers). Targeting
this road infrastructure, which supports the enriched everyday living of
people in Japan, a Road Infrastructure Monitoring System (RIMS) will be
developed initially for expressways, to be expanded in future to general
roads, based on the roads’ degree of impact on the general public’s everyday
living and the status of their maintenance systems.
This system will supplement existing inspection technology, utilizing
a wireless sensor network to enable 24-hour continuous and comprehensive
knowledge of the status of road infrastructure. It is also suitable for
monitoring locations that are difficult to access and responding to sudden
phenomena such as disasters.
Through this research, we will develop new compact, inexpensive, high-performance, high-durability wireless sensor terminals suitable for use in monitoring various fields (bridges, road equipment, slopes, etc.) that have independent electricity sources utilizing ambient energy. We will standardize wireless communication sensor networks and high-durability packaging, carrying out efficient development and constructing a system that makes integrated total maintenance of road infrastructure possible. Through collaboration with user businesses (multiple expressway companies), sensor businesses, communication systems businesses, and packaging businesses, we will develop a system that meets the overall needs of road infrastructure.
Implementation of the monitoring system developed will enable diagnosis
of aging and damage in various fields, and by expanding the research results
obtained with expressways to general roads, it will be possible to extend
the longevity of road infrastructure. Through this, we aim to contribute
to the assurance of safe, secure, and enriched everyday living for people
in Japan.
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[Overview diagram of R&D]
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The R&D themes and institutions conducting R&D under the Road Infrastructure Monitoring System (RIMS) development project are as follows.
Development of a bridge sensing system utilizing super acoustic sensors
(Toshiba Corporation, The University of Tokyo, and Kyoto University)
- A MEMS-based super acoustic sensor device is being developed with a new
architecture for covering a broad frequency range with a single device.
Development of a bridge sensing system utilizing 2D-strain-pattern sensor
sheets (National Institute of Advanced Industrial Science and Technology
(AIST), Dai Nippon Printing Co., Ltd. and The University of Tokyo)
- A 2D-strain-pattern sensor sheet is being developed to establish a sensing
system capable of wirelessly mapping strain distribution in the main girders
and slabs of bridges simply by affixing sheets to the bridge adhesively.
Development of a tilt sensing system for road equipment (Fuji Electric
Co., Ltd.)
- A capacitive MEMS-based 3-axes sensor device is being developed for the
high-precision, simultaneous measurement of tilt and vibration of road
equipment.
Development of a slope displacement sensing system (Mitsubishi Electric
Corporation)
- A high data rate, all-weather, 3D sensing system is being developed for
detecting slope displacement at a high precision based on phase differences
in radio signals.
Development of a common platform for wireless communication networks (NTT
DATA Corporation)
- A common platform is being constructed as a framework for the collection,
storage, and provision of data received from a wide variety of sensors
that have been installed in road infrastructure.
Development of a highly durable packaging technology (Micromachine Center,
National Institute of Advanced Industrial Science and Technology (AIST),
NGK Insulators, Ltd., and Dai Nippon Printing Co., Ltd.)
- An all-in-one packaging technology for sensor terminal components, including
sensors, wireless circuits, antennas, and stand-alone power supplies, is
being developed to resolve issues of reliability in harsh environments,
vulnerability to lightning strikes, and difficulties in installing terminals
on structures in order to ensure the durability of the sensor terminals.
Demonstration and evaluation study on sensor systems for road infrastructure
monitoring (All participating institutions)
- A demonstration and evaluation study is being conducted on a sensor system utilizing a wireless sensor network to monitor the condition of road infrastructure.
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Diagram of research themes/blocks
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